Stalam a PACK EXPO International 2026 a Chicago

30 Settembre 2026

Stalam will take part in PACK EXPO International 2026, one of the leading international exhibitions for packaging and processing technologies, taking place in Chicago, USA, from 18 to 21 October.

Together with Scan American Corporation, Stalam’s exclusive distributor for the American market, we will present the advantages of industrial radio frequency (RF) technology for food processing applications.

Discover the potential of radio frequency technology

Are you looking for faster, more efficient and flexible thermal processing solutions?

Radio frequency technology enables food manufacturers to optimise production processes through rapid, volumetric and uniform heating, offering significant advantages in terms of processing times, product quality and operational efficiency.

At PACK EXPO International, visitors will have the opportunity to learn more about Stalam’s RF solutions for:

  • Rapid and uniform defrosting: accelerate the thawing of frozen food products while helping preserve their quality and reduce processing times.
  • Efficient pasteurisation and heating: achieve controlled thermal treatment for different food products, supporting continuous processing and improved production efficiency.
  • Sanitisation and microbial reduction: apply RF technology to support microbial reduction in selected food products and raw materials.

Designed to meet the requirements of modern food processing facilities, Stalam’s solutions offer flexibility, process control and the possibility of integrating RF technology into existing production lines.

Meet Stalam and Scan American at PACK EXPO International

Our team will be available throughout the exhibition to discuss your production requirements, explore potential applications and identify how radio frequency technology can contribute to your processing operations.

Whether you are looking to improve defrosting performance, optimise thermal treatment or explore new processing opportunities, we look forward to discussing your project.

Event details

  • Exhibition: PACK EXPO International 2026
  • Dates: 18–21 October 2026
  • Venue: McCormick Place, Chicago, Illinois, USA
  • Booth: LU-7508
  • Exhibiting with: Scan American Corporation, Stalam’s exclusive distributor for the American market

Visit us at Booth LU-7508 and discover how Stalam’s radio frequency technology can support your food processing operations.